DBT Bureau
Pune, 13 August 2025
In a major push to strengthen India’s semiconductor ecosystem, the Union Cabinet chaired by Prime Minister Narendra Modi has approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM). With this move, the total number of approved projects under ISM has reached 10, representing a cumulative investment of ₹1.6 lakh crore across six states.
The four new proposals—by SiCSem, Continental Device India Pvt. Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies—will collectively attract an investment of ₹4,600 crore and create over 2,000 skilled jobs, apart from numerous indirect employment opportunities.
Boost to Atmanirbhar Bharat in Semiconductors
The projects will cater to the soaring demand for semiconductors in telecom, automotive, data centers, consumer electronics, industrial electronics, and AI applications, helping India achieve its goal of becoming a global manufacturing hub.
State-Wise Project Highlights:
Odisha:
SiCSem (in collaboration with UK’s Clas-SiC Wafer Fab Ltd.) will establish India’s first commercial compound semiconductor fab at Info Valley, Bhubaneswar. The facility will manufacture Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and 96 million packaged units, catering to EVs, defence, railways, fast chargers, solar inverters, and data centers.
3D Glass Solutions Inc. will set up a world-class advanced packaging and embedded glass substrate unit in Bhubaneswar. This facility will bring cutting-edge technologies such as 3D Heterogeneous Integration (3DHI) and glass interposers, critical for defence, high-performance computing, AI, RF, automotive, and photonics.
Andhra Pradesh:
ASIP Technologies will establish a semiconductor packaging facility in collaboration with APACT Co. Ltd., South Korea, with a capacity of 96 million units annually, focused on mobile devices, automotive electronics, and consumer applications.
Punjab:
Continental Device (CDIL) will expand its Mohali-based facility to manufacture high-power discrete devices including MOSFETs, IGBTs, Schottky Diodes, and transistors in Silicon and Silicon Carbide. The plant will have a capacity of 158.38 million units per year, targeting EVs, renewable energy systems, industrial applications, and communication infrastructure.
Strategic Milestones
With these approvals, India will have its first compound semiconductor fab and a highly advanced glass-based substrate packaging unit, complementing the country’s rapidly growing chip design capabilities. The government’s initiatives have already supported 278 academic institutions and 72 start-ups, and over 60,000 students have benefitted from talent development programs.
“Momentum is building up in the semiconductor ecosystem in India. These projects will make India a global leader in next-gen chip manufacturing and packaging technologies,” said an official statement.
